Electronic assembly with improved thermal management



The invention relates to an electronic assembly comprising a leadframe (2), a semiconductor component (3), and an electrically conductive connecting element (4) made of a composite material (5). The connecting element (4) has a solderable metallization (6) on the composite material (5) on a surface that is directed towards the semiconductor component (3). A thermal conductivity of the composite material (5) of the connecting element (4) is greater than a thermal conductivity of the semiconductor component (3) and less than a thermal conductivity of the leadframe (2). The connecting element (4) is provided only locally in the region of the semiconductor component (3).




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Patent Citations (3)

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    US-5202288-AApril 13, 1993Robert Bosch GmbhMethod of manufacturing an electronic circuit component incorporating a heat sink

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